21. Why does the program show TP connection error ?
…………………………..
EROM Color = 4 : RED
EROM CID = 52
Hint : Now the probe might be disconnected
Processing ...
Error : Failed.
There are several reasons for this trouble:
- The user has selected the wrong TP schematic.
- Mistakenly defined type of the chip substrate because the substrate leads got oxidized.
- A TP needle is too thick, so it touches the adjacent components or the ground (protective shield).
- Besides, such problem may be caused by the previous modification of the TP adapter: a 150 pF capacitor soldered into the TP-adapter to stabilize operation with the E-Gold platform may cause equipment errors while working with SonyEricsson models. Therefore, we recommend to remove the capacitor mentioned above (Note: the TP-adapter will not work properly with Siemens E-Gold models after removal of the capacitor).
22. What is the normal duration of the TP1 and TP2 process?
When you have touched the proper TP and the DBSS message prompts you to remove the needle, TP1 should finish within 7-10 sec. and TP2 – within 20-30 sec. If the process lasts too long – the only explanation is that the TP schematic was not selected properly or there are other problems (for details see Answer 21).
23. Is it necessary to repeat the TP1 after the TP2 finished with error?
No, it is not necessary if you have not disconnected the cable from the phone and have not powered the handset off.
24. If the SecurityBypass procedure has been already performed in a phone, should it be repeated once more for this specific handset?
No, there is no need to do this as the Security area of a certain phone remains accessible even after flashing this phone with full flash file from either the same or another handset.
25. Is it necessary to flash the phone with the GDFS file backed up from another handset of the same model in order to restore it?
It is necessary only if the phone was previously flashed with the GDFS file, backed up from the handset of a different model (e.g., GDFS from К610 was flashed into К800 phone). If the phone was just blocked «with five locks», the GDFS can be restored without writing the GDFS file from another phone.
26. What is Unlock & Repair GDFS sec. Blocks option meant for?
This procedure performs:
- GDFS recalculation in the phone locked for 5 locks.
- GDFS recalculation after processor replacing (either with the brand new processor or with the component taken from a "donor" handset).
- Direct unlock of the phone.
27. Why does the process hangs at 25% and shows Error when I try to turn the phone into the boot mode?
It is obvious that phone's hardware is damaged. Most probably flash memory chip or processor are defective; the other reason may be cold solder joints under the components as a result of falling down or other damages.
28. Can the cable for another similar device be used with the DreamBox?
No, it cannot; SE cable schematic (pinout) is located at the product's official site.
29. How should I work with the DB that does not support autodetect option and shows Error when the Start button is pressed?
This problem happens because of unstable contact of TP-adapter needle with the TP. During the TP procedure it is important to hold the TP-adapter needle in contact with the TP WITHOUT BREAKAGE until the message: "Now the testpoint may be disconnected" is displayed. If you fail to perform this, an Error will appear. It is worth to remember another important thing: TP1 contact should be hold without breakage for 1-2 sec. and the TP2 – for 2-4 sec.
30. After flashing with a Full Flash file, the phone is still not operating. What should I do?
After writing a Full Flash file, backed up from another phone, a user has to perform the following steps:
- Perform Security Bypass procedure in TestPoint mode (if this procedure has been already performed for this handset, move straight to step "b")
- Perform Unlock & Repair GDFS sec. Blocks procedure in Security Bypass mode.
- Write Fota + Main + FS + Cust.Pac into the phone.
31. While connecting via TP, the software allows to remove the TP and hangs. Why does it happen?
This type of errors is caused by the previous modification of the TP-adapter for operation with Siemens E-Gold platform – a 150 pF capacitor was soldered into the needle holding shell of the TP-adapter to stabilize operation with this platform. However, in this case the capacitor is an obstruction of proper operation by causing such errors. Thus, the problem can be solved by removing of the above mentioned capacitor, but after such an upgrade the DB operation with E-Gold platform will become unstable.
Figure 6
32. Why does W200 unlock process via TestPoint sometimes hangs at TP №1?
To solve this problem, please perform the following steps:
- Insert the SIM card of the locking service provider into the phone and turn it on.
- Reset all phone settings through the menu.
- Replace the default theme for another theme and/or create a new contact in the phone book.
After these operations, please, repeat the Security Bypass procedure in TestPoint mode.
33. How to correct the error?
- Stage 2 start.
- Timeout detected.
- Error: Failed.
The error happens because the user disconnects the TP needle from the TP too soon, before the message:
Hint: Now the probe might be disconnected appears in the dialogue box.
The other cause resulting in such a failure is the unstable contact of the TP needle with the TP (connection failed).
34. How to repair GDFS?
- Select the required model from the list.
- Choose Test Point access mode. If the Security Bypass procedure was previously performed with this phone, please refer to the Step 5.
- Log to the Security tab.
- Perform Security Bypass operation.
- Choose Security Bypass access mode.
- If the phone's malfunction is caused by an unknown reason, it is recommended to flash the handset with the Full Flash file. Otherwise, if it's clearly defined that the GDFS zone is corrupted, please flash the phone with the GDFS file.
- Perform "Unlock And Repair GDFS Security Blocks" (Misc. tab).
- Flash the phone with the Main + FS + Custpac flash files.
If the specified above procedure doesn't help to repair the phone, there can be 2 reasons for that:
- Hardware failure as a consequence of dropping, fluid damage, factory defect.
- Wrong model selected. There is a possibility that the PCB doesn't correspond to the model indicated on the housing of the phone (a housing of K800 contains a K790 PCB, a W580 housing – contains a S500 PCB etc).
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